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SIR870BDP-T1-RE3 - Vishay

Description: MOSFET N-CHANNEL 100 V

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PCB Footprints
SIR870BDP-T1-RE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_111
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3D Models
SIR870BDP-T1-RE3 - Vishay  - 3D model - Other - PowerPAK® SO-8 Single_111
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SIR870BDP-T1-RE3 Details

  • Manufacturer Part Number:

    SIR870BDP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2020-01-13

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.9

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    81 A

  • Drain-source On Resistance-Max:

    0.0077 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    19 pF

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    100 W

  • Pulsed Drain Current-Max (IDM):

    200 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    98 ns

  • Turn-on Time-Max (ton):

    60 ns

SIR870BDP-T1-RE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIR870BDP-T1-RE3 is a standard TO-252 (D-PAK) footprint with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a solder flux to the pins. Use a solder with a melting point of 180°C to 220°C, and avoid applying excessive force or pressure to the component during soldering.
  • The maximum allowed voltage on the SIR870BDP-T1-RE3's input pins is 20V, but it's recommended to keep the input voltage within the specified operating range of 4.5V to 18V to ensure reliable operation.
  • The SIR870BDP-T1-RE3 is rated for operation up to 150°C, but it's recommended to derate the component's power dissipation and operating voltage at higher temperatures to ensure reliable operation and prevent thermal runaway.
  • To calculate the power dissipation of the SIR870BDP-T1-RE3, use the formula: Pd = (Vin - Vout) x Iout, where Vin is the input voltage, Vout is the output voltage, and Iout is the output current. Make sure to consider the component's thermal resistance and maximum junction temperature when calculating the power dissipation.

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SIR870BDP-T1-RE3 Overview

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