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SIR871DP-T1-GE3 - Vishay

Description: MOSFET -100V Vds 20V Vgs SO-8

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SIR871DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_11
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SIR871DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIR871DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Date Of Intro:

    2016-07-19

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.85

  • Avalanche Energy Rating (Eas):

    61 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    48 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    300 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIR871DP-T1-GE3 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat effectively. A minimum of 2 oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the pads, and use a reflow oven or a hot air gun to solder the device. Avoid overheating or applying excessive force, which can damage the device.
  • The maximum operating temperature range for the SIR871DP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • The SIR871DP-T1-GE3 is a commercial-grade device, but it can be used in high-reliability or aerospace applications with proper qualification and testing. It's recommended to consult with Vishay Intertechnologies or a qualified reliability engineer to ensure the device meets the specific requirements of your application.
  • To prevent damage, store the SIR871DP-T1-GE3 in its original packaging or in a dry, ESD-protected environment. Avoid exposing the device to moisture, extreme temperatures, or physical stress. Handle the device by the body, avoiding touching the pins or electrical connections.

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SIR871DP-T1-GE3 Overview

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