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SIR882ADP-T1-GE3 - Vishay

Description: N-Channel 100 V (D-S) MOSFET

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SIR882ADP-T1-GE3 - Vishay PCB footprint - Other - Other - SIR882ADP-T1-GE3-1
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SIR882ADP-T1-GE3 - Vishay  - 3D model - Other - SIR882ADP-T1-GE3-1
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SIR882ADP-T1-GE3 Details

  • Manufacturer Part Number:

    SIR882ADP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0087 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    83 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIR882ADP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIR882ADP-T1-GE3 is a pad layout with a minimum size of 2.5 mm x 2.5 mm, with a thermal pad size of 1.5 mm x 1.5 mm. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the SIR882ADP-T1-GE3 on the pads. Use a reflow oven or a hot air gun to solder the component. Make sure to follow the recommended soldering profile to prevent damage to the component.
  • The maximum operating temperature range for the SIR882ADP-T1-GE3 is -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • Handle the SIR882ADP-T1-GE3 with care to prevent damage. Store the components in their original packaging or in a dry, ESD-protected environment. Avoid exposing the components to moisture, extreme temperatures, or physical stress during shipping and storage.
  • The SIR882ADP-T1-GE3 is an ESD-sensitive device. To prevent damage, use ESD-protective equipment, such as wrist straps, mats, and bags, when handling the component. Ensure that the workspace and tools are ESD-protected, and follow proper ESD-handling procedures.

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SIR882ADP-T1-GE3 Overview

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