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- Part Number SIR882BDP-T1-RE3
- Manufacturer Vishay
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - PowerPAK SO-8 Single
- Released Date May 24, 2024
- Last Modified Date May 24, 2024 10:44 AM UTC
- Pinout / Pin List Click Here (Member Only)
SIR882BDP-T1-RE3 Details
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Manufacturer Part Number:
SIR882BDP-T1-RE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Factory Lead Time:
24 Weeks
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Date Of Intro:
2020-05-27
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5.9
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Avalanche Energy Rating (Eas):
45 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
SIR882BDP-T1-RE3 Frequently Asked Questions (FAQs)
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The recommended land pattern for the SIR882BDP-T1-RE3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for QFN and DFN Packages' (document number 37977).
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The thermal pad should be connected to a solid copper plane on the PCB to ensure good thermal dissipation. A thermal relief pattern can be used to connect the thermal pad to the copper plane. Additionally, a thermal interface material (TIM) can be applied between the thermal pad and the PCB to improve thermal conductivity.
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The maximum operating temperature range for the SIR882BDP-T1-RE3 is -40°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
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Yes, the SIR882BDP-T1-RE3 is qualified for automotive and high-reliability applications. It meets the requirements of the AEC-Q101 standard and is PPAP (Production Part Approval Process) capable.
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The SIR882BDP-T1-RE3 should be soldered using a reflow soldering process with a peak temperature of 260°C. The recommended soldering profile can be found in the JEDEC standard J-STD-020D. Additionally, a solder paste with a high melting point (e.g., SAC305) should be used to ensure reliable solder joints.
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SIR882BDP-T1-RE3 Overview
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