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SIRA10DP-T1-GE3 - Vishay

Description: Vishay SIRA10DP-T1-GE3 N-channel MOSFET Transistor, 30 A, 30 V, 8-Pin PowerPAK SO

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PCB Footprints
SIRA10DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK SO-8 Single-2022
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3D Models
SIRA10DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK SO-8 Single-2022
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SIRA10DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIRA10DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    3

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0037 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    140 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SIRA10DP-T1-GE3 Frequently Asked Questions (FAQs)

  • Store the devices in a dry, cool place, away from direct sunlight, and avoid exposure to moisture, dust, and extreme temperatures.
  • Yes, SIRA10DP-T1-GE3 is designed for high-reliability applications, such as aerospace, defense, and industrial control systems, due to its high-quality materials and manufacturing process.
  • Use proper ESD protection measures, such as wrist straps, mats, and packaging, to prevent damage to the device during handling and assembly.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 30s, and time above 183°C 60s, to ensure reliable solder joints.
  • Yes, SIRA10DP-T1-GE3 is rated for operation up to 150°C, making it suitable for high-temperature applications, but ensure proper thermal management and derating.

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SIRA10DP-T1-GE3 Overview

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