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SIRA58ADP-T1-RE3 - Vishay

Description: MOSFET 40V Vds 20/-16V Vgs PowerPAK SO-8

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SIRA58ADP-T1-RE3 - Vishay PCB footprint - Other - Other - SIRA58ADP-T1-RE3-1
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SIRA58ADP-T1-RE3 - Vishay  - 3D model - Other - SIRA58ADP-T1-RE3-1
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SIRA58ADP-T1-RE3 Details

  • Manufacturer Part Number:

    SIRA58ADP-T1-RE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    24 Weeks

  • Date Of Intro:

    2018-06-17

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    109 A

  • Drain-source On Resistance-Max:

    0.00265 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation Ambient-Max:

    5 W

  • Power Dissipation-Max (Abs):

    56.8 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    176 ns

SIRA58ADP-T1-RE3 Frequently Asked Questions (FAQs)

  • Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
  • To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 30 seconds, and a soldering iron temperature of 350°C. Use a solder with a melting point of 217°C or higher.
  • The maximum allowed voltage derating for the SIRA58ADP-T1-RE3 is 80% of the rated voltage. This means that if the rated voltage is 58V, the maximum allowed voltage derating would be 46.4V.
  • Store the SIRA58ADP-T1-RE3 in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent electrostatic discharge damage.
  • The recommended torque for the screw terminals of the SIRA58ADP-T1-RE3 is 0.5 Nm to 1.5 Nm. Over-tightening can damage the terminals, while under-tightening can lead to poor connections.

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SIRA58ADP-T1-RE3 Overview

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