Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a solid copper plane or a grid of thermal vias.
To ensure reliable soldering, follow the recommended soldering profile: peak temperature of 260°C, time above 217°C of 30-45 seconds, and a maximum of 3 reflows. Use a solder with a melting point above 217°C, and ensure the PCB is clean and free of oxidation.
The maximum allowed voltage derating for the SIRA96DP-T1-GE3 is 80% of the rated voltage. This means that if the device is rated for 1000V, the maximum allowed voltage derating would be 800V.
To prevent ESD damage, handle the device in an ESD-protected environment, wear an ESD wrist strap or use an ESD mat, and ensure all equipment and tools are grounded. Avoid touching the device's pins or leads, and use ESD-safe packaging and storage materials.
Store the SIRA96DP-T1-GE3 in a dry, cool place with a temperature range of -40°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or contaminants.
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SIRA96DP-T1-GE3 Overview
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