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SIRB40DP-T1-GE3 - Vishay

Description: MOSFET 40V Vds 20V Vgs PowerPAK SO-8

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PCB Footprints
SIRB40DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK-SO8_1
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3D Models
SIRB40DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK-SO8_1
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SIRB40DP-T1-GE3 Details

  • Manufacturer Part Number:

    SIRB40DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Germany

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Date Of Intro:

    2016-09-25

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    31.25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    40 A

  • Drain-source On Resistance-Max:

    0.00325 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    102 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    46.2 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    84 ns

  • Turn-on Time-Max (ton):

    248 ns

SIRB40DP-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SIRB40DP-T1-GE3 is a pad size of 4.5mm x 2.5mm with a 0.5mm thermal pad.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid overheating the component.
  • The maximum operating temperature range for the SIRB40DP-T1-GE3 is -55°C to 175°C.
  • Yes, the SIRB40DP-T1-GE3 is suitable for use in high-humidity environments, but it's recommended to apply a conformal coating to protect the component from moisture.
  • Handle the SIRB40DP-T1-GE3 in an ESD-protected environment, wear an ESD wrist strap, and use ESD-safe packaging and tools to prevent ESD damage.

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SIRB40DP-T1-GE3 Overview

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