- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SIS178LDN-T1-GE3
- Part Number SIS178LDN-T1-GE3
- Manufacturer Vishay
- Pin Count 11
- Part Category MOSFET (N-Channel)
- Package Category Other
- Footprint Name Other - SIS178LDN-T1-GE3-1
- Released Date Oct 4, 2021
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SIS178LDN-T1-GE3 Details
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Manufacturer Part Number:
SIS178LDN-T1-GE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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Factory Lead Time:
24 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
5
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Avalanche Energy Rating (Eas):
11.25 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
70 V
SIS178LDN-T1-GE3 Frequently Asked Questions (FAQs)
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Vishay recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
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Vishay recommends using a soldering profile with a peak temperature of 260°C (500°F) for a maximum of 10 seconds. The device should be soldered using a solder with a melting point above 217°C (423°F).
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The maximum allowed voltage on the gate pin is ±20 V, but it's recommended to keep it within ±15 V to ensure reliable operation and prevent damage to the device.
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Yes, the SIS178LDN-T1-GE3 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, thermal performance, and PCB layout to ensure reliable operation.
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Vishay recommends handling the device with ESD-protective equipment and following proper ESD-handling procedures. The device should be stored in an ESD-protective package, and it's recommended to use an ESD-protection circuit on the PCB.
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SIS178LDN-T1-GE3 Overview
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