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SISS10ADN-T1-GE3 - Vishay

Description: Trans MOSFET N-CH 40V 31.7A 8-Pin PowerPAK 1212 EP T/R

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PCB Footprints
SISS10ADN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® 1212-8 Single_2
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3D Models
SISS10ADN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® 1212-8 Single_2
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SISS10ADN-T1-GE3 Details

  • Manufacturer Part Number:

    SISS10ADN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2018-10-02

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.6

  • Avalanche Energy Rating (Eas):

    45 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    109 A

  • Drain-source On Resistance-Max:

    0.00265 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    52 pF

  • JESD-30 Code:

    S-PDSO-N5

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    56.8 W

  • Pulsed Drain Current-Max (IDM):

    150 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    70 ns

  • Turn-on Time-Max (ton):

    36 ns

SISS10ADN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SISS10ADN-T1-GE3 is a pad size of 1.3 mm x 0.8 mm with a 0.5 mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves and thermal management guidelines provided in the datasheet. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation.
  • The maximum allowed voltage for the SISS10ADN-T1-GE3 is 100 V. Exceeding this voltage may result in device damage or failure. It's essential to ensure that the operating voltage is within the recommended range to ensure device reliability.
  • The SISS10ADN-T1-GE3 is designed for low-frequency applications. While it can be used in high-frequency applications, its performance may degrade due to increased power losses. It's recommended to consult with a Vishay Intertechnologies application engineer to determine the suitability of the device for high-frequency applications.
  • The typical lead time for the SISS10ADN-T1-GE3 varies depending on the region, quantity, and availability. It's recommended to check with authorized distributors or Vishay Intertechnologies' customer service for the most up-to-date lead time information.

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SISS10ADN-T1-GE3 Overview

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