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SISS67DN-T1-GE3 - Vishay

Description: VISHAY - SISS67DN-T1-GE3 - MOSFET, P-CH, -30V, -60A, 150DEG C

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PCB Footprints
SISS67DN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK 1212-8 Single_2
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3D Models
SISS67DN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK 1212-8 Single_2
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SISS67DN-T1-GE3 Details

  • Manufacturer Part Number:

    SISS67DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    460 pF

  • JESD-30 Code:

    S-PDSO-N8

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    65.8 W

  • Pulsed Drain Current-Max (IDM):

    120 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    114 ns

  • Turn-on Time-Max (ton):

    100 ns

SISS67DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SISS67DN-T1-GE3 is a pad layout with a minimum size of 1.5 mm x 1.5 mm, with a 0.5 mm radius corner, and a 0.3 mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux with a moderate activity level. Avoid using excessive solder or flux, and ensure the component is properly aligned on the PCB.
  • The maximum operating temperature range for the SISS67DN-T1-GE3 is -55°C to 150°C, with a derating of 1.33 mΩ/°C above 25°C.
  • Yes, the SISS67DN-T1-GE3 is designed to withstand high-vibration environments, with a vibration rating of 10 G peak acceleration, 10 Hz to 2 kHz frequency range, and 1 hour duration per axis.
  • To handle ESD protection for the SISS67DN-T1-GE3, use a wrist strap or mat with a resistance of 1 MΩ to 10 MΩ, and ensure the component is stored in an ESD-protected environment.

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SISS67DN-T1-GE3 Overview

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