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SISS73DN-T1-GE3 - Vishay

Description: P-Channel 150 V (D-S) MOSFET PowerPAK 12

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PCB Footprints
SISS73DN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK 1212-8 Single
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SISS73DN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK 1212-8 Single
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SISS73DN-T1-GE3 Details

  • Manufacturer Part Number:

    SISS73DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    29 Weeks

  • Date Of Intro:

    2019-02-07

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.97

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    16.2 A

  • Drain-source On Resistance-Max:

    0.125 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    7 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    65.8 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    48 ns

  • Turn-on Time-Max (ton):

    32 ns

SISS73DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SISS73DN-T1-GE3 is a standard SOT23 package with a 1.3mm x 1.3mm pad size, and a 0.5mm x 0.5mm thermal pad.
  • To ensure reliability, follow the recommended operating temperature range (-55°C to 150°C), use a suitable thermal interface material, and ensure proper PCB design and layout to minimize thermal resistance.
  • The maximum allowed power dissipation for SISS73DN-T1-GE3 is 1.44W at 25°C, and it is essential to follow the derating curve to ensure safe operation.
  • Yes, SISS73DN-T1-GE3 is suitable for high-frequency switching applications up to 1MHz, but ensure proper PCB design, layout, and decoupling to minimize parasitic inductance and capacitance.
  • Follow proper ESD handling procedures, use ESD-protective packaging, and consider adding external ESD protection devices if necessary, as SISS73DN-T1-GE3 has a human body model (HBM) ESD rating of 2kV.

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SISS73DN-T1-GE3 Overview

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