The recommended PCB footprint for the SISS98DN-T1-GE3 is a pad size of 1.3 mm x 0.8 mm with a 0.5 mm spacing between pads. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent thermal runaway.
To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curves for the SISS98DN-T1-GE3. Additionally, ensure proper thermal management, such as using a heat sink or thermal interface material, and avoid exceeding the maximum junction temperature (Tj) of 150°C.
The maximum allowed voltage for the SISS98DN-T1-GE3 is 100 V. Exceeding this voltage may result in permanent damage to the device. It's essential to ensure that the voltage rating is not exceeded in the application.
To prevent damage during storage and shipping, it's recommended to store the SISS98DN-T1-GE3 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to moisture, extreme temperatures, or physical stress.
The typical lead time for the SISS98DN-T1-GE3 may vary depending on the region, distributor, and quantity. However, the standard lead time is usually around 8-12 weeks. It's recommended to check with authorized distributors or Vishay Intertechnologies for the most up-to-date lead time information.
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SiSS98DN-T1-GE3 Overview
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