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SIZ200DT-T1-GE3 - Vishay

Description: Dual N-Channel 30-V (D-S) MOSFETs Symm. PowerPAIR 3 x 3 1G sh ch , 5.5 m @ 10V m @ 7.5V 7.3 m @ 4.5V

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PCB Footprints
SIZ200DT-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAIR® 3.3 x 3.3_2025
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3D Models
SIZ200DT-T1-GE3 - Vishay  - 3D model - Other - PowerPAIR® 3.3 x 3.3_2025
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SIZ200DT-T1-GE3 Details

  • Manufacturer Part Number:

    SIZ200DT-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    26 Weeks

  • Date Of Intro:

    2018-04-22

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Case Connection:

    DRAIN SOURCE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    61 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    28 pF

  • JESD-30 Code:

    S-PDSO-N8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    33 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    60 ns

  • Turn-on Time-Max (ton):

    115 ns

SIZ200DT-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended storage temperature range for SIZ200DT-T1-GE3 is -40°C to 125°C, as per Vishay's general guidelines for storage and handling of semiconductor devices.
  • While the SIZ200DT-T1-GE3 is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments (> 80% RH) without proper protection, such as conformal coating or hermetic sealing, to prevent moisture-related failures.
  • The maximum allowable power dissipation for the SIZ200DT-T1-GE3 is dependent on the operating temperature and thermal resistance. As a general guideline, the maximum power dissipation is 1.5 W at 25°C, but this value decreases as the temperature increases. Consult the datasheet and thermal derating curves for more information.
  • Yes, the SIZ200DT-T1-GE3 is RoHS (Restriction of Hazardous Substances) and REACH (Registration, Evaluation, Authorization, and Restriction of Chemicals) compliant, meeting the European Union's regulations for environmental sustainability and safety.
  • The recommended soldering temperature profile for the SIZ200DT-T1-GE3 is a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a ramp rate of 3°C/s. However, it's essential to consult the datasheet and follow Vishay's recommended soldering guidelines to ensure reliable assembly.

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SIZ200DT-T1-GE3 Overview

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