Littelfuse recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a heat sink.
To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for voltage and current. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
The SJ6008DS2RP has a surge current rating of 100 A for 10 ms, as specified in the datasheet. However, it's essential to note that the device can handle higher surge currents for shorter durations, but this should be verified through simulation or testing.
Yes, the SJ6008DS2RP can be used in a parallel configuration to increase current handling. However, it's crucial to ensure that the devices are matched in terms of voltage and current ratings, and that the PCB layout is designed to minimize current imbalance and thermal mismatch.
Littelfuse recommends using a wire bonding technique with a minimum wire size of 24 AWG and a maximum bond temperature of 250°C. For soldering, a reflow soldering process with a peak temperature of 260°C is recommended.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
SJ6008DS2RP Overview
Use the download button to access the SJ6008DS2RP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SJ600,
or try a keyword search, such as Silicon Controlled Rectifiers
