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SJD12A12L01 - Yageo Group

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SJD12A12L01 Details

  • Manufacturer Part Number:

    SJD12A12L01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOD-123S, 2 PIN

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    28 Weeks, 2 Days

  • Date Of Intro:

    2018-11-02

  • Manufacturer:

    YAGEO Corporation

  • YTEOL:

    6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    14.7 V

  • Breakdown Voltage-Min:

    13.3 V

  • Breakdown Voltage-Nom:

    14 V

  • Clamping Voltage-Max:

    19.9 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JESD-30 Code:

    R-PDSO-F2

  • Non-rep Peak Rev Power Dis-Max:

    200 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

SJD12A12L01 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SJD12A12L01 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink. The thermal pad should be connected to a copper plane or a heat sink to dissipate heat efficiently. Additionally, avoid applying excessive heat during soldering, and use a soldering iron with a temperature control to prevent overheating.
  • The maximum operating temperature range for SJD12A12L01 is -40°C to 125°C. However, it's recommended to operate the device within the temperature range of -20°C to 85°C for optimal performance and reliability.
  • To ensure reliability in high-humidity environments, apply a conformal coating to the PCB to prevent moisture ingress. Additionally, use a moisture-resistant packaging material, such as a moisture-barrier bag, to store the components. It's also recommended to bake the components before assembly to remove any moisture that may have been absorbed during storage.
  • The recommended storage condition for SJD12A12L01 is in a dry, cool place with a temperature range of 5°C to 30°C and a relative humidity of 60% or less. Avoid storing the components in direct sunlight, high-temperature environments, or areas with high humidity.

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SJD12A12L01 Overview

Use the download button to access the SJD12A12L01 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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