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- Stock & Prices $ Price & Stock for SK36BHE3-LTP
- Part Number SK36BHE3-LTP
- Manufacturer MCC
- Pin Count 2
- Part Category Schottky Diode
- Package Category Diodes Moulded
- Footprint Name Diodes Moulded - SMA (DO-214AC)
- Released Date Jan 31, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
SK36BHE3-LTP Details
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Manufacturer Part Number:
SK36BHE3-LTP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Mainland China, Vietnam
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Micro Commercial Components
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YTEOL:
6
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Application:
GENERAL PURPOSE
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Breakdown Voltage-Min:
60 V
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Configuration:
SINGLE
SK36BHE3-LTP Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid copper pour on the top and bottom layers, and keeping the thermal path as short as possible to the heat sink or thermal pad.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range, use a heat sink or thermal pad, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
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The maximum allowable voltage stress on the SK36BHE3-LTP is 1.5 times the maximum rated voltage, but it's recommended to limit the voltage stress to 1.2 times the maximum rated voltage to ensure long-term reliability.
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To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, handle the device by the body or pins, avoid touching the pins or die, and use ESD-protective packaging and storage materials.
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The recommended soldering profile for the SK36BHE3-LTP involves a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a total process time of 60-90 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.
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SK36BHE3-LTP Overview
Use the download button to access the SK36BHE3-LTP schematic symbol, PCB footprint, and 3D model.
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