- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SK56BHE3-LTP
- Part Number SK56BHE3-LTP
- Manufacturer MCC
- Pin Count 2
- Part Category Diode
- Package Category Diodes Moulded
- Footprint Name Diodes Moulded - SMB (DO-214AA)
- Released Date Jan 31, 2024
- Last Modified Date May 17, 2024 4:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
SK56BHE3-LTP Details
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Manufacturer Part Number:
SK56BHE3-LTP
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SMB, 2 PIN
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Country Of Origin:
Mainland China, Vietnam
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ECCN Code:
EAR99
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HTS Code:
8541.10.00.80
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Manufacturer:
Micro Commercial Components
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YTEOL:
6
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Application:
GENERAL PURPOSE
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Breakdown Voltage-Min:
60 V
SK56BHE3-LTP Frequently Asked Questions (FAQs)
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The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the package, using a minimum of 2oz copper thickness, and ensuring a solid ground plane on the top and bottom layers. Additionally, it's recommended to use vias to connect the thermal pad to the ground plane.
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To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the device. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature. Ensure proper airflow and avoid overheating the device.
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The recommended soldering conditions for the SK56BHE3-LTP are: peak temperature of 260°C, soldering time of 10 seconds, and a soldering iron temperature of 350°C. It's also recommended to use a solder with a melting point of 217°C to 220°C.
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To handle ESD protection during handling and assembly, use an ESD wrist strap or mat, and ensure that all equipment and tools are grounded. Avoid touching the component's pins or body, and use ESD-safe packaging materials. Follow the recommended ESD handling procedures outlined in the datasheet.
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The recommended storage conditions for the SK56BHE3-LTP are: temperature range of -40°C to 125°C, humidity of 60% or less, and storage in an ESD-safe environment. Avoid exposing the component to direct sunlight, moisture, or extreme temperatures.
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SK56BHE3-LTP Overview
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