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SL2S2602FUD/BGZ - NXP

Description: IC RFID TRANSP 13.56MHZ WAFER

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SL2S2602FUD/BGZ - NXP  - 3D model
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SL2S2602FUD/BGZ Details

  • Manufacturer Part Number:

    SL2S2602FUD/BGZ

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DIE-4

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • JESD-30 Code:

    R-XUUC-N4

  • Length:

    0.558 mm

  • Memory Density:

    2560 bit

  • Memory IC Type:

    NFC/RFID TAGS AND TRANSPONDERS

  • Memory Width:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    4

  • Number of Words:

    320 words

  • Number of Words Code:

    320

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    320X8

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    DIE

  • Package Equivalence Code:

    DIE OR CHIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    UNCASED CHIP

  • Seated Height-Max:

    0.12 mm

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    UPPER

  • Width:

    0.555 mm

SL2S2602FUD/BGZ Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SL2S2602FUD/BGZ is -40°C to 125°C.
  • To ensure proper power supply, connect the VDD pin to a 1.8V to 3.6V power source, and the VSS pin to ground. Also, decouple the power supply with a 10nF capacitor.
  • The SL2S2602FUD/BGZ supports data transfer rates up to 100 Mbps.
  • To configure the SL2S2602FUD/BGZ for I2C mode, connect the SCL pin to a clock signal and the SDA pin to a data signal. For SPI mode, connect the SCK pin to a clock signal, the MOSI pin to a data output, and the MISO pin to a data input.
  • The WAKEUP pin is used to wake up the device from a low-power state. It is an active-low input that, when driven low, triggers the device to exit its low-power mode.

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SL2S2602FUD/BGZ Overview

Use the download button to access the SL2S2602FUD/BGZ 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SL2S2, or try a keyword search, such as Other Telecom ICs

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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