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SLA7062MLF2102 - Allegro Microsystems

Description: UNIPOLAR STEPPER-MOTOR TRANSLATOR/DRIVERS

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PCB Footprints
SLA7062MLF2102 - Allegro Microsystems PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - SIP-21
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3D Models
SLA7062MLF2102 - Allegro Microsystems  - 3D model - Transistor Outline, Vertical - SIP-21
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SLA7062MLF2102 Details

  • Manufacturer Part Number:

    SLA7062MLF2102

  • Pbfree Code:

    No

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    ZFM

  • Package Description:

    SIP-21

  • Pin Count:

    21

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Allegro MicroSystems LLC

  • YTEOL:

    3

  • Additional Feature:

    ALSO REQUIRES 10V TO 44V SUPPLY

  • Analog IC - Other Type:

    STEPPER MOTOR CONTROLLER

  • JESD-30 Code:

    R-XZFM-T21

  • Number of Functions:

    1

  • Number of Terminals:

    21

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    ZIP

  • Package Equivalence Code:

    ZIP21,.16,.1,56TB

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    1.42 mm

  • Terminal Position:

    ZIG-ZAG

  • Time@Peak Reflow Temperature-Max (s):

    40

SLA7062MLF2102 Frequently Asked Questions (FAQs)

  • A good thermal design should be used to ensure the device operates within the recommended temperature range. A minimum of 2 oz copper thickness is recommended, and thermal vias should be used to dissipate heat. The datasheet provides a recommended PCB layout, but it's essential to consult with a thermal expert or Allegro's application notes for specific guidance.
  • The SLA7062MLF2102 requires a stable power supply with minimal noise and ripple. A decoupling capacitor (e.g., 10uF ceramic) should be placed close to the device, and the power supply lines should be filtered using a ferrite bead or a pi-filter. Additionally, ensure the PCB layout is designed to minimize electromagnetic interference (EMI).
  • The SLA7062MLF2102 is a QFN package, which requires a controlled soldering process to prevent damage. Allegro recommends using a reflow oven with a peak temperature of 240°C (max) and a dwell time of 30-60 seconds. For rework, use a hot air station with a temperature-controlled nozzle and a low-flow nitrogen atmosphere.
  • Use a logic analyzer or an oscilloscope to monitor the device's output signals. Check the device's input signals, power supply, and decoupling capacitors. Consult Allegro's application notes and datasheet for specific troubleshooting guidelines. If issues persist, contact Allegro's technical support for further assistance.
  • The SLA7062MLF2102 is rated for operation in the -40°C to 125°C temperature range. Ensure the device is operated within the recommended temperature range and humidity levels. Follow Allegro's recommended storage and handling procedures to prevent damage. Consult the datasheet and application notes for specific reliability and environmental considerations.

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