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SLB9665TT20FW563XUMA3 - Infineon

Description: Security ICs / Authentication ICs TPM

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SLB9665TT20FW563XUMA3 - Infineon - PCB symbol
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PCB Footprints
SLB9665TT20FW563XUMA3 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - TSSOP_2020
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3D Models
SLB9665TT20FW563XUMA3 - Infineon - 3D model - Small Outline Packages - TSSOP_2020
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SLB9665TT20FW563XUMA3 Details

  • Manufacturer Part Number:

    SLB9665TT20FW563XUMA3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TSSOP-28

  • HTS Code:

    8542.31.00.30

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    3

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    9.7 mm

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP28,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Width:

    4.4 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

SLB9665TT20FW563XUMA3 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN215, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The SLB9665TT20FW563XUMA3 has a thermal pad on the bottom of the package, which should be connected to a thermal plane on the PCB. Additionally, Infineon recommends using a heat sink or thermal interface material to improve heat dissipation.
  • The input capacitors should be low-ESR, high-frequency capacitors with a minimum capacitance of 10uF and a voltage rating of at least 25V. X7R or X5R dielectric capacitors are recommended.
  • Infineon provides a troubleshooting guide in their application note AN217, which includes steps for identifying and resolving common issues with the SLB9665TT20FW563XUMA3.
  • The output capacitors should be low-ESR, high-frequency capacitors with a minimum capacitance of 10uF and a voltage rating of at least 2x the output voltage. Ceramic capacitors with an X7R or X5R dielectric are recommended.

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SLB9665TT20FW563XUMA3 Overview

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