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SLF12555T-150M2R8-PF - TDK

Description: Inductor SMD shielded wirewound 15uH TDK Shielded Wire-wound SMD Inductor with a Ferrite Core, 15 uH /-20% 3.9A Idc

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SLF12555T-150M2R8-PF - TDK PCB footprint - Other - Other - SLF12555
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SLF12555T-150M2R8-PF - TDK  - 3D model - Other - SLF12555
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SLF12555T-150M2R8-PF Details

  • Manufacturer Part Number:

    SLF12555T-150M2R8-PF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    4949

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.0259 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    5.5 mm

  • Package Length:

    12.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.5 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    3.9 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE MEASURED AT: 20%

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    20%

SLF12555T-150M2R8-PF Frequently Asked Questions (FAQs)

  • The recommended land pattern for SLF12555T-150M2R8-PF can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of SLF12555T-150M2R8-PF. It is recommended to use a thermal pad or thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K to ensure efficient heat dissipation. Additionally, the PCB design should include thermal vias and a solid ground plane to help dissipate heat.
  • While the datasheet specifies the rated temperature range, it's essential to note that the maximum operating temperature range for SLF12555T-150M2R8-PF is typically -40°C to +125°C. However, it's recommended to derate the component's performance and reliability at temperatures above 85°C to ensure long-term reliability.
  • SLF12555T-150M2R8-PF is designed to withstand moderate vibration levels. However, if the application involves high-vibration environments, it's recommended to consult with TDK Corporation's application engineers to determine the suitability of the component. Additional mechanical support or fixation may be required to ensure the component's reliability.
  • To ensure the reliability of SLF12555T-150M2R8-PF in high-humidity environments, it's recommended to follow proper storage and handling procedures, such as storing the components in a dry, nitrogen-filled environment. Additionally, the PCB design should include moisture-resistant coatings and conformal coatings to protect the component from moisture ingress.

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SLF12555T-150M2R8-PF Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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