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SLF12575T-1R2N8R2-H - TDK

Description: SMD / SMT Inductors (Coils), L=1.2?H, L x W x T :

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SLF12575T-1R2N8R2-H - TDK PCB footprint - Other - Other - SLF12575
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SLF12575T-1R2N8R2-H - TDK  - 3D model - Other - SLF12575
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SLF12575T-1R2N8R2-H Details

  • Manufacturer Part Number:

    SLF12575T-1R2N8R2-H

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    4949

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.0051 Ω

  • Inductance-Nom (L):

    1.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    7.5 mm

  • Package Length:

    12.5 mm

  • Package Style:

    SMT

  • Package Width:

    12.5 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    8.2 A

  • Reference Standard:

    AEC-Q200

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DC RESISTANCE IS MEASURED AT 20%

  • Surface Mount:

    YES

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    30%

SLF12575T-1R2N8R2-H Frequently Asked Questions (FAQs)

  • The recommended land pattern for SLF12575T-1R2N8R2-H can be found in the TDK Corporation's recommended land pattern document, which is usually available on their website or through their customer support. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
  • Thermal management is critical for the reliability and performance of SLF12575T-1R2N8R2-H. It is recommended to use a thermal pad or a heat sink to dissipate heat away from the component. The thermal pad or heat sink should be designed to ensure good thermal conductivity and should be attached to the component using a thermally conductive adhesive or solder.
  • The maximum operating temperature range for SLF12575T-1R2N8R2-H is typically specified as -40°C to +125°C, but it's recommended to check the datasheet or consult with TDK Corporation's customer support for the most up-to-date and accurate information.
  • SLF12575T-1R2N8R2-H is designed to be robust and reliable, but it's still important to consider the vibration environment in which it will be used. TDK Corporation provides vibration testing data and guidelines for their components, which can be found in the datasheet or through their customer support. It's recommended to consult with TDK Corporation's customer support to determine the suitability of SLF12575T-1R2N8R2-H for a specific vibration environment.
  • To ensure the reliability of SLF12575T-1R2N8R2-H in a humid environment, it's recommended to follow proper storage and handling procedures, such as storing the components in a dry and clean environment, and using moisture-resistant packaging. Additionally, it's recommended to use conformal coating or potting to protect the component from moisture and humidity.

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SLF12575T-1R2N8R2-H Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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