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SLF6025T-150MR88-PF - TDK

Description: TDK Shielded Wire-wound SMD Inductor 15 μH ±20% Wire-Wound 880mA Idc

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SLF6025T-150MR88-PF - TDK PCB footprint - Other - Other - SLF6025
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SLF6025T-150MR88-PF - TDK  - 3D model - Other - SLF6025
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SLF6025T-150MR88-PF Details

  • Manufacturer Part Number:

    SLF6025T-150MR88-PF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Case/Size Code:

    2424

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.085 Ω

  • Inductance-Nom (L):

    15 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.5 mm

  • Package Length:

    6 mm

  • Package Style:

    SMT

  • Package Width:

    6 mm

  • Packing Method:

    TR, Embossed Plastic, 13 Inch

  • Rated Current-Max:

    1.1 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Special Feature:

    DCR IS MEASURED AT 20 % TOLERANCE

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SLF6025T-150MR88-PF Frequently Asked Questions (FAQs)

  • The recommended land pattern for SLF6025T-150MR88-PF can be found in the TDK Corporation's application note or footprint library. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal and electrical issues.
  • Thermal derating is critical for power inductors like SLF6025T-150MR88-PF. Engineers should consider the maximum operating temperature, ambient temperature, and thermal resistance to calculate the derated current. TDK Corporation provides thermal derating curves in the datasheet or application notes to help with this calculation.
  • The recommended soldering profile for SLF6025T-150MR88-PF can be found in the TDK Corporation's application note or soldering guide. A typical reflow soldering profile includes a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. However, it's essential to consult the specific application note for the exact profile.
  • To ensure magnetic shielding, engineers should consider the inductor's orientation, proximity to other components, and the PCB layout. It's recommended to keep the inductor away from sensitive components, use a shielded layout, and orient the inductor to minimize magnetic field radiation. TDK Corporation provides application notes and design guides to help with magnetic shielding.
  • The equivalent series resistance (ESR) of SLF6025T-150MR88-PF is not explicitly stated in the datasheet. However, engineers can estimate the ESR by using the inductor's DC resistance and the frequency of operation. TDK Corporation provides ESR calculation formulas and guidelines in their application notes.

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SLF6025T-150MR88-PF Overview

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About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

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