Description:The SLG46826 provides a small, low power component for commonly used mixed-signal functions. The user creates the circuit design by programming the multiple time Non-Volatile Memory (NVM) to configure the interconnect logic, the IOs and the macrocells of the SLG46826. This highly versatile device allows a wide variety of mixed-signal functions to be designed within a very small, low power single integrated circuit.
Renesas provides a recommended PCB layout guide in the SLG46826G application note (Document Number: R01DS0244EJ0100). It's essential to follow this guide to ensure optimal performance, minimize noise, and reduce electromagnetic interference (EMI).
To achieve the best accuracy, it's recommended to use an external crystal oscillator. However, if you need to use the internal oscillator, ensure that the VDD voltage is stable and within the recommended range. Also, use the OSCCFG register to select the optimal oscillator frequency and mode for your application.
The maximum current that can be sourced or sunk by the GPIO pins is 4mA per pin. However, it's recommended to limit the current to 2mA per pin to ensure reliable operation and prevent overheating.
The SLG46826G has a built-in WDT that can be enabled and configured using the WDTCSR register. You can set the WDT timeout period, enable or disable the WDT, and configure the WDT reset mode. Refer to the datasheet and application notes for more information.
The SLG46826G has a maximum junction temperature (TJ) of 150°C. To ensure reliable operation, it's essential to provide adequate heat dissipation, such as using a heat sink or thermal pad, and ensuring good airflow around the device. You should also avoid overheating the device during soldering or rework.
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SLG46826G Overview
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