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SLG59M301V - Renesas Electronics

Description: The SLG59M301V is a 8.5 mΩ 4 A single-channel load switch that is able to switch 0.85 V to 5.5 V power rails. The product is packaged in an ultra-small 1.5 mm x 2.0 mm package.

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SLG59M301V - Renesas Electronics - PCB symbol
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PCB Footprints
SLG59M301V - Renesas Electronics PCB footprint - Other - Other - SLG59M301V
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3D Models
SLG59M301V - Renesas Electronics - 3D model - Other - SLG59M301V
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SLG59M301V Details

  • Manufacturer Part Number:

    SLG59M301V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TDFN-8 (1.5 x 2.0 mm)

  • Country Of Origin:

    Mainland China, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Adjustable Threshold:

    NO

  • Analog IC - Other Type:

    Load switch

  • JESD-30 Code:

    R-PDSO-N8

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VSON

  • Package Equivalence Code:

    SOLCC8,.06,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.105 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Width:

    1.5 mm

SLG59M301V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current limits, and that the PCB is designed to minimize thermal resistance. Also, consider using thermal protection circuits or thermal sensors to monitor temperature.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, decreased performance, and potentially even device failure. It is essential to ensure that the device operates within the recommended temperature range to maintain reliability.
  • Implement ESD protection measures such as using ESD-resistant components, adding ESD protection diodes, and following proper handling and storage procedures to prevent damage from electrostatic discharge.
  • Ensure that the power supply voltage is stable and within the recommended range before applying it to the device. Also, consider using power sequencing circuits to ensure that the device is powered up correctly.

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SLG59M301V Overview

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