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SLRC61003HNY - NXP

Description: NFC/RFID Tags & Transponders NTAG 5 and ICODE frontend

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PCB Footprints
SLRC61003HNY - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
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3D Models
SLRC61003HNY - NXP  - 3D model - Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
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  • Datasheet Download Datasheet
  • Stock & Prices $ Price & Stock for SLRC61003HNY
  • Part Number SLRC61003HNY
  • Manufacturer NXP
  • Pin Count 33
  • Part Category Integrated Circuit
  • Package Category Quad Flat No-Lead
  • Footprint Name Quad Flat No-Lead - HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85
  • Released Date Nov 12, 2024
  • Last Modified Date Nov 12, 2024 9:43 AM UTC
  • Pinout / Pin List Click Here (Member Only)

SLRC61003HNY Details

  • Manufacturer Part Number:

    SLRC61003HNY

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HVQFN-32

  • Country Of Origin:

    Mainland China, Taiwan

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2018-06-27

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    8

  • JESD-30 Code:

    S-PQCC-N32

  • JESD-609 Code:

    e4

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    2

  • Number of Terminals:

    32

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC32,.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    5 mm

  • uPs/uCs/Peripheral ICs Type:

    NFC CONTROLLER

SLRC61003HNY Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SLRC61003HNY is -40°C to 125°C.
  • Ensure a stable power supply with a voltage range of 1.71V to 1.89V, and decouple the power pins with a 10uF capacitor to minimize noise and voltage drops.
  • The SLRC61003HNY supports a maximum clock frequency of 100 MHz.
  • Configure the device for low-power mode by setting the PWRDN pin high, and ensure that the clock frequency is reduced or stopped to minimize power consumption.
  • The TEST pin is used for factory testing and should be connected to VSS (ground) during normal operation.

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SLRC61003HNY Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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