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SM12T1G - onsemi

Description: SOT–23 Package Allows Either Two Separate Unidirectional Configurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage 5 V; Standard Zener Breakdown Voltage Range 6.2 V to 7.3 V; Peak Power – 300 Watt (8 X 20 µs); Low Leakage; Flammability Rating UL 94V–O; Mechanical Characteristics: CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260 ?C for 10 Seconds Package designed f

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SM12T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318−08 ISSUE AS *
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SM12T1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT−23 (TO−236) CASE 318−08 ISSUE AS *
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SM12T1G Details

  • Manufacturer Part Number:

    SM12T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    9 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.41

  • Breakdown Voltage-Max:

    15.75 V

  • Breakdown Voltage-Min:

    13.3 V

  • Breakdown Voltage-Nom:

    14.53 V

  • Clamping Voltage-Max:

    19 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SM12T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, thermal vias can be used to further improve heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • The SM12T1G has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Additionally, consider adding external ESD protection devices if the device will be exposed to harsh environments.
  • Choose an input capacitor with a voltage rating that exceeds the maximum input voltage, and a capacitance value that meets the recommended range (typically 10uF to 22uF). The capacitor should also have a low ESR to minimize voltage ripple.
  • When paralleling multiple devices, ensure that each device has its own input capacitor and that the output currents are balanced. Also, consider the total power dissipation and thermal management of the system.

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SM12T1G Overview

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