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SM15T47CAY - STMicroelectronics

Description: STMicroelectronics SM15T47CAY Bi-Directional TVS Diode, 1500W peak, 2-Pin DO-214AB

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SM15T47CAY - STMicroelectronics - PCB symbol
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SM15T47CAY - STMicroelectronics PCB footprint - Diodes Moulded Non Polarised - Diodes Moulded Non Polarised - SMC
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SM15T47CAY - STMicroelectronics - 3D model - Diodes Moulded Non Polarised - SMC
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SM15T47CAY Details

  • Manufacturer Part Number:

    SM15T47CAY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    7

  • Breakdown Voltage-Max:

    49.4 V

  • Breakdown Voltage-Min:

    44.7 V

  • Breakdown Voltage-Nom:

    47 V

  • Clamping Voltage-Max:

    64.5 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Peak Rev Power Dis-Max:

    1500 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2; ISO 10605; MIL-STD-750

  • Rep Pk Reverse Voltage-Max:

    40.2 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    40.2 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SM15T47CAY Frequently Asked Questions (FAQs)

  • STMicroelectronics recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including junction temperature (Tj) and storage temperature (Tstg). Additionally, consider using a heat sink, thermal interface material, and a robust PCB design to minimize thermal resistance.
  • To prevent electrostatic discharge (ESD) damage, handle the device by the body or pins, avoid touching the die, and use an ESD wrist strap or mat. Ensure the PCB design includes ESD protection components, such as TVS diodes or ESD arrays, and follow proper soldering and assembly procedures.
  • Choose input and output capacitors with low equivalent series resistance (ESR) and high ripple current capability. The recommended capacitance values are 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor. Consider using X7R or X5R dielectric capacitors for their stability over temperature and voltage.
  • The internal compensation network is designed to provide stability and optimize the device's performance. However, it may affect the device's response to certain input signals or operating conditions. Ensure that your design takes into account the internal compensation network's characteristics, and consider using external compensation components if necessary.

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SM15T47CAY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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