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SM24T1G - onsemi

Description: Peak Power 300 Watt (8/20 us); SZ Prefix for AEC-Q101 and Other Applications Requiring Unique Site and Control Change (PPAP) Requirements; SOT23 Package Allows Either Two Separate UnidirectionalConfigurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage Range 5.0 V to 12 V; Low Leakage; Pb-Free Packages are Available

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PCB Footprints
SM24T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SM24T1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SM24T1G Details

  • Manufacturer Part Number:

    SM24T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    7 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.38

  • Breakdown Voltage-Max:

    31.35 V

  • Breakdown Voltage-Min:

    26.7 V

  • Breakdown Voltage-Nom:

    29 V

  • Clamping Voltage-Max:

    43 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    24 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    24 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SM24T1G Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias under the device is recommended. This helps to dissipate heat efficiently and reduce thermal resistance.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A reflow soldering profile with a peak temperature of 260°C (500°F) and a dwell time of 20-30 seconds is recommended. Avoid exceeding 280°C (536°F) to prevent damage to the device.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. Use an ESD-protective bag or container for storage and transportation.
  • Use a gold wire bonding process with a wire diameter of 0.7-1.0 mil (18-25 μm). For die attach, use a silver-filled epoxy or a gold-tin solder with a bond line thickness of 1-2 mil (25-50 μm).

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SM24T1G Overview

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