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SM30T19AY - STMicroelectronics

Description: Automotive 3000 W TVS in SMC

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SM30T19AY - STMicroelectronics PCB footprint - Other - Other - SM30TxxAY
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SM30T19AY - STMicroelectronics  - 3D model - Other - SM30TxxAY
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SM30T19AY Details

  • Manufacturer Part Number:

    SM30T19AY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    19.6 V

  • Breakdown Voltage-Min:

    17.8 V

  • Breakdown Voltage-Nom:

    18.7 V

  • Clamping Voltage-Max:

    26 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    16 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    16 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SM30T19AY Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and to use thermal vias to connect the thermal pad of the SM30T19AY to the ground plane. This helps to dissipate heat efficiently.
  • To ensure reliable operation at high temperatures, it's essential to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Also, ensure that the device is properly cooled, and the thermal management is adequate.
  • To prevent ESD damage, handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Also, avoid touching the device's pins or leads, and use an anti-static wrist strap or mat.
  • When selecting a gate driver for the SM30T19AY, consider the driver's output current capability, rise and fall times, and the ability to handle the MOSFET's gate capacitance. Also, ensure the driver's output voltage is compatible with the MOSFET's gate-source voltage rating.
  • When paralleling multiple SM30T19AY devices, ensure that each device has its own gate driver, and the gate drivers are synchronized to prevent shoot-through currents. Also, ensure that the devices are properly matched, and the PCB layout is designed to minimize current imbalances.

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SM30T19AY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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