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SM30T33AY - STMicroelectronics

Description: Automotive 3000 W TVS in SMC

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SM30T33AY - STMicroelectronics PCB footprint - Other - Other - SM30TxxAY
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SM30T33AY - STMicroelectronics  - 3D model - Other - SM30TxxAY
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SM30T33AY Details

  • Manufacturer Part Number:

    SM30T33AY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AB

  • Package Description:

    SMC, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    34.3 V

  • Breakdown Voltage-Min:

    31.1 V

  • Breakdown Voltage-Nom:

    32.7 V

  • Clamping Voltage-Max:

    45.4 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    28 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    28 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SM30T33AY Frequently Asked Questions (FAQs)

  • A good PCB layout for the SM30T33AY should include a solid ground plane, wide copper traces for power and ground, and a thermal relief pattern under the package to facilitate heat dissipation.
  • To ensure reliable operation at high temperatures, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended thermal management guidelines in the datasheet.
  • To minimize EMI and RFI, use a shielded enclosure, keep sensitive circuits away from the SM30T33AY, and use filtering and shielding techniques as recommended in the datasheet.
  • Choose external components that meet the recommended specifications in the datasheet, considering factors such as voltage rating, current handling, and temperature range.
  • Monitor the SM30T33AY's junction temperature, input voltage, output current, and power dissipation to ensure reliable operation and prevent overheating or damage.

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SM30T33AY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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