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SM30T56CAY - STMicroelectronics

Description: Automotive 3000 W, 48 V TVS in SMC

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PCB Footprints
SM30T56CAY - STMicroelectronics PCB footprint - Other - Other - SMC_BD
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SM30T56CAY - STMicroelectronics  - 3D model - Other - SMC_BD
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SM30T56CAY Details

  • Manufacturer Part Number:

    SM30T56CAY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    58.8 V

  • Breakdown Voltage-Min:

    53.2 V

  • Breakdown Voltage-Nom:

    56 V

  • Clamping Voltage-Max:

    76.6 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    48 V

  • Reverse Current-Max:

    0.2 µA

  • Reverse Test Voltage:

    48 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

SM30T56CAY Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal management, use a heat sink or thermal pad, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • A reflow soldering profile with a peak temperature of 240°C to 250°C and a dwell time of 20-30 seconds is recommended. Avoid exceeding 260°C to prevent damage.
  • Handle the device in an ESD-protected environment, use ESD-protective packaging, and ensure that all equipment and personnel are grounded. Use an ESD wrist strap or mat when handling the device.
  • Store the device in a dry, cool place (less than 30°C and 60% relative humidity) away from direct sunlight and moisture. Use anti-static packaging and avoid bending or flexing the leads.

Trust Checks

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Manufacturer Collaborated
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SM30T56CAY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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