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SM30T6.8CAY - STMicroelectronics

Description: Automotive 3000 W, 5 V TVS in SMC

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SM30T6.8CAY - STMicroelectronics PCB footprint - Other - Other - SMC_BD
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SM30T6.8CAY - STMicroelectronics  - 3D model - Other - SMC_BD
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SM30T6.8CAY Details

  • Manufacturer Part Number:

    SM30T6.8CAY

  • Brand Name:

    STMicroelectronics

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMC, 2 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    53 Weeks, 1 Day

  • Manufacturer:

    STMicroelectronics

  • YTEOL:

    8

  • Additional Feature:

    MIL-STD-750

  • Breakdown Voltage-Max:

    7.1 V

  • Breakdown Voltage-Min:

    6.45 V

  • Breakdown Voltage-Nom:

    6.78 V

  • Clamping Voltage-Max:

    9.2 V

  • Configuration:

    SINGLE, 1 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AB

  • JESD-30 Code:

    R-PDSO-C2

  • Non-rep Peak Rev Power Dis-Max:

    3000 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity:

    BIDIRECTIONAL

  • Reference Standard:

    AEC-Q101; IEC-61000-4-2, 4-4; ISO 7637-2

  • Rep Pk Reverse Voltage-Max:

    5 V

  • Reverse Current-Max:

    500 µA

  • Reverse Test Voltage:

    5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

SM30T6.8CAY Frequently Asked Questions (FAQs)

  • A symmetrical layout with thermal vias and a solid ground plane is recommended. Ensure a minimum of 2mm clearance around the package for airflow.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Monitor junction temperature and adjust the system design accordingly.
  • Exceeding the maximum junction temperature can lead to reduced lifespan, increased thermal resistance, and potential device failure. Ensure proper thermal management to prevent overheating.
  • Yes, but ensure compliance with relevant industry standards (e.g., MIL-STD-883) and perform thorough testing and validation. Consult with STMicroelectronics for specific guidance.
  • Implement ESD protection measures during handling, storage, and assembly. Use ESD-safe materials, follow proper handling procedures, and consider adding external ESD protection devices if necessary.

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SM30T6.8CAY Overview

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About STMicroelectronics

STMicroelectronics (ST) is a global semiconductor company that designs, manufactures, and markets a broad range of integrated circuits (ICs), discrete devices, and other electronic components. STMicroelectronics offers a diverse portfolio of semiconductor products covering a wide range of applications and industries. Their product categories include microcontrollers, analog and mixed-signal ICs, MEMS (Micro-Electro-Mechanical Systems) sensors, power management ICs, RF (Radio Frequency) transceivers, aut

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