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SM320C6727BGDHMEP - Texas Instruments

Description: Enhanced Product Floating-Point Digital Signal Processor

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SM320C6727BGDHMEP - Texas Instruments PCB footprint - BGA - BGA - GDH(S-PBGA-N256)
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3D Models
SM320C6727BGDHMEP - Texas Instruments  - 3D model - BGA - GDH(S-PBGA-N256)
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SM320C6727BGDHMEP Details

  • Manufacturer Part Number:

    SM320C6727BGDHMEP

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    256

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A001.A.2.C

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    IT ALSO OPERATES AT 3.3 OR 1.8 V FOR I/O SUPPLY

  • Address Bus Width:

    32

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    250 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • Length:

    17 mm

  • Low Power Mode:

    NO

  • Moisture Sensitivity Level:

    3

  • Number of Terminals:

    256

  • Number of Timers:

    1

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • RAM (words):

    65536

  • Seated Height-Max:

    2.02 mm

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.14 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

SM320C6727BGDHMEP Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device operation and prevents latch-up.
  • To optimize power consumption, use the device's power-down modes (e.g., IDLE, STANDBY, and HALT), reduce the clock frequency, and minimize the number of active peripherals. Additionally, use the device's built-in power management features, such as the Power Manager (PM) module.
  • The maximum clock frequency supported by the SM320C6727 is 300 MHz. However, the actual clock frequency may be limited by the specific application and the device's operating conditions.
  • To ensure reliable data transfer, use the device's Error Correction Code (ECC) feature, implement data integrity checks, and use a robust memory interface protocol (e.g., DDR2 or DDR3). Additionally, ensure that the memory timing and signal integrity requirements are met.
  • The maximum operating temperature range for the SM320C6727 is -40°C to 100°C (industrial temperature range). However, the device can be operated at extended temperatures (up to 125°C) with reduced performance and reliability.

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SM320C6727BGDHMEP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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