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SM32C6713BGDPA20EP - Texas Instruments

Description: Enhanced Product Floating-Point Digital Signal Processor

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SM32C6713BGDPA20EP - Texas Instruments PCB footprint - BGA - BGA - GDP (S–PBGA–N272)
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3D Models
SM32C6713BGDPA20EP - Texas Instruments  - 3D model - BGA - GDP (S–PBGA–N272)
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SM32C6713BGDPA20EP Details

  • Manufacturer Part Number:

    SM32C6713BGDPA20EP

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    BGA

  • Pin Count:

    272

  • Country Of Origin:

    Philippines

  • ECCN Code:

    3A991.A.2

  • HTS Code:

    8542.31.00.35

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Additional Feature:

    ALSO REQUIRES 3.3V SUPPLY

  • Address Bus Width:

    22

  • Barrel Shifter:

    NO

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • Clock Frequency-Max:

    200 MHz

  • External Data Bus Width:

    32

  • Format:

    FLOATING POINT

  • Integrated Cache:

    YES

  • Internal Bus Architecture:

    MULTIPLE

  • JESD-30 Code:

    S-PBGA-B272

  • JESD-609 Code:

    e0

  • Length:

    27 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of DMA Channels:

    16

  • Number of External Interrupts:

    4

  • Number of Terminals:

    272

  • Number of Timers:

    2

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA272,20X20,50

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Qualification Status:

    Not Qualified

  • RAM (words):

    4096

  • Seated Height-Max:

    2.57 mm

  • Supply Current-Max:

    560 mA

  • Supply Voltage-Max:

    1.32 V

  • Supply Voltage-Min:

    1.2 V

  • Supply Voltage-Nom:

    1.26 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    27 mm

  • uPs/uCs/Peripheral ICs Type:

    DIGITAL SIGNAL PROCESSOR, OTHER

SM32C6713BGDPA20EP Frequently Asked Questions (FAQs)

  • The recommended power-on sequence is to apply VDD (1.2V) first, followed by VIO (1.8V or 3.3V) and then the clock signal. This ensures proper device initialization and prevents latch-up.
  • The EMIF can be configured for SDRAM by setting the EMIF control registers (EMCR) to select the SDRAM mode, and then configuring the SDRAM timing parameters (e.g., CAS latency, refresh rate) using the SDRAM control registers (SDCR).
  • The maximum frequency for the EDMA controller is 135 MHz, which is the same as the maximum frequency of the CPU.
  • The McBSP can be configured for TDM applications by setting the McBSP control registers (MCR) to select the TDM mode, and then configuring the TDM parameters (e.g., frame sync, slot size) using the TDM control registers (TCR).
  • The AWDT is a safety feature that resets the device if the software fails to periodically refresh the watchdog timer. This ensures that the device is reset in case of a software fault or hang.

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SM32C6713BGDPA20EP Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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