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SM36T1G - onsemi

Description: SOT23 Package Allows Either Two Separate UnidirectionalConfigurations or a Single Bidirectional Configuration; Working Peak Reverse Voltage Range 5.0 V to 12 V; Peak Power 300 Watt (8 X 20 us); Low Leakage; Flammability Rating UL 94 V0; Pb-Free Packages are Available; AEC-Q101 Qualified and PPAP Capable; SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements

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Symbol
SM36T1G - onsemi - PCB symbol
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PCB Footprints
SM36T1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SM36T1G - onsemi - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SM36T1G Details

  • Manufacturer Part Number:

    SM36T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Factory Lead Time:

    6 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.28

  • Breakdown Voltage-Max:

    46.95 V

  • Breakdown Voltage-Min:

    40 V

  • Breakdown Voltage-Nom:

    43.5 V

  • Clamping Voltage-Max:

    60 V

  • Configuration:

    COMMON ANODE, 2 ELEMENTS, 2 CHANNEL

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    300 W

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    0.225 W

  • Reference Standard:

    IEC-61000-4-2, 4-4, 4-5

  • Rep Pk Reverse Voltage-Max:

    36 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    36 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

SM36T1G Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to a solid copper plane on the inner layers.
  • Ensure that the device is operated within the recommended junction temperature (Tj) range of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the package when designing the system. A heat sink or thermal interface material may be necessary for high-power applications.
  • A reflow soldering profile with a peak temperature of 260°C and a dwell time of 20-30 seconds is recommended. The device should be soldered using a no-clean or water-soluble flux, and the PCB should be designed with a solder mask to prevent solder bridging.
  • Handle the device by the body or use an ESD wrist strap or mat to prevent static buildup. Ensure that the PCB is designed with ESD protection devices, such as TVS diodes or ESD arrays, to protect the SM36T1G from voltage transients.
  • A low-ESR ceramic capacitor with a value of 10-22uF is recommended for input decoupling. The capacitor should be placed as close as possible to the device's input pins to minimize inductance and ensure stable operation.

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SM36T1G Overview

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