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SM470R1B1MHKPS - Texas Instruments

Description: MCU 16-bit/32-bit ARM7TDMI RISC 1MB Flash 3V 84-Pin CQFP EP Tube

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SM470R1B1MHKPS - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - HKP (S-CQFP-G84)
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SM470R1B1MHKPS - Texas Instruments  - 3D model - Quad Flat Packages - HKP (S-CQFP-G84)
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SM470R1B1MHKPS Details

  • Manufacturer Part Number:

    SM470R1B1MHKPS

  • Brand Name:

    Texas Instruments

  • Part Life Cycle Code:

    Obsolete

  • Pin Count:

    84

  • ECCN Code:

    3A001.A.2.A

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES MINIMUM 1.71 V AT 48 MHZ

  • Bit Size:

    32

  • Boundary Scan:

    YES

  • CPU Family:

    ARM7

  • Clock Frequency-Max:

    10 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • Format:

    FIXED POINT

  • Integrated Cache:

    NO

  • JESD-30 Code:

    S-CQFP-G84

  • Length:

    13.81 mm

  • Low Power Mode:

    YES

  • Number of DMA Channels:

    16

  • Number of I/O Lines:

    8

  • Number of Serial I/Os:

    12

  • Number of Terminals:

    84

  • Number of Timers:

    13

  • On Chip Data RAM Width:

    8

  • On Chip Program ROM Width:

    8

  • Operating Temperature-Max:

    220 °C

  • Operating Temperature-Min:

    -55 °C

  • PWM Channels:

    YES

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    HFQFP

  • Package Equivalence Code:

    HQFP84,.76SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, HEAT SINK/SLUG, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    65536

  • ROM (words):

    1048576

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    2.8 mm

  • Speed:

    60 MHz

  • Supply Current-Max:

    125 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3.3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    13.81 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER, RISC

SM470R1B1MHKPS Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure that the thermal pad is connected to a large copper area to dissipate heat efficiently.
  • Implement a robust power-on reset circuit, ensure a stable clock source, and use a reliable voltage regulator. Also, consider using a temperature sensor to monitor the device temperature.
  • Use a combination of ceramic and electrolytic capacitors for decoupling, with a total capacitance of at least 10uF. Place the capacitors close to the power pins and use a low-ESR capacitor for the core voltage.
  • Use a clock tree with a single, centralized clock source. Ensure that the clock signal is routed as a differential pair, and use a clock buffer to minimize jitter and skew.
  • Use a controlled impedance PCB design, and route high-speed signals as differential pairs. Avoid vias and sharp corners, and use a signal integrity analysis tool to optimize the design.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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