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SM4F26A-TP - MCC

Description: 42.1V Clamp 9.5A Ipp Tvs Diode Surface Mount SOD-123FL

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PCB Footprints
SM4F26A-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL_2023
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3D Models
SM4F26A-TP - MCC  - 3D model - Small Outline Diode Flat Lead - SOD-123FL_2023
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SM4F26A-TP Details

  • Manufacturer Part Number:

    SM4F26A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Additional Feature:

    EXCELLENT CLAMPING CAPABILITY

  • Breakdown Voltage-Max:

    31.9 V

  • Breakdown Voltage-Min:

    28.9 V

  • Breakdown Voltage-Nom:

    30.4 V

  • Clamping Voltage-Max:

    42.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • Forward Voltage-Max (VF):

    3.5 V

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    26 V

  • Reverse Current-Max:

    1 µA

  • Reverse Test Voltage:

    26 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SM4F26A-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SM4F26A-TP should consider the following: keep the input and output traces separate, use a solid ground plane, and place decoupling capacitors close to the device. Additionally, ensure that the PCB material has a high thermal conductivity to dissipate heat efficiently.
  • To ensure reliability in high-temperature applications, follow these guidelines: operate the device within the recommended temperature range, use a heat sink or thermal pad to dissipate heat, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Also, consider using a thermally conductive adhesive or thermal interface material to improve heat transfer.
  • To prevent electrostatic discharge (ESD) damage, handle the SM4F26A-TP with care: use an ESD wrist strap or mat, touch a grounded object before handling the device, and avoid touching the pins or leads. Also, ensure that your workspace and equipment are ESD-safe.
  • Yes, the SM4F26A-TP can be used in switching power supply applications. However, ensure that the device is operated within its recommended specifications, and consider the following: use a suitable output capacitor to filter the output voltage, and ensure that the input voltage is within the recommended range.
  • To troubleshoot issues with the SM4F26A-TP, follow these steps: check the input voltage and current, verify the output voltage and current, and inspect the PCB layout for any errors or damage. Also, check the device's thermal performance and ensure that the heat sink or thermal pad is properly attached. Consult the datasheet and application notes for more guidance.

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SM4F26A-TP Overview

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