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SM73302MF/NOPB - Texas Instruments

Description: 88 MHz, Precision, Low Noise, 1.8V CMOS Input, Decompensated Operational Amplifier

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PCB Footprints
SM73302MF/NOPB - Texas Instruments PCB footprint - SOT23 (5-Pin) - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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3D Models
SM73302MF/NOPB - Texas Instruments  - 3D model - SOT23 (5-Pin) - DBV (R-PDSO-G5)
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SM73302MF/NOPB Details

  • Manufacturer Part Number:

    SM73302MF/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    5

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    5e-7 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G5

  • JESD-609 Code:

    e3

  • Length:

    2.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    5

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LSSOP

  • Package Equivalence Code:

    TSOP5/6,.11,37

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Seated Height-Max:

    1.45 mm

  • Slew Rate-Nom:

    28 V/us

  • Supply Current-Max:

    1.4 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    88000

  • Voltage Gain-Min:

    12600

  • Wideband:

    NO

  • Width:

    1.6 mm

SM73302MF/NOPB Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane to reduce thermal resistance.
  • To ensure reliable operation across the entire operating temperature range, it is essential to follow proper PCB design and layout guidelines, including thermal management, decoupling, and signal integrity considerations. Additionally, ensure that the device is properly soldered and that the PCB material is suitable for the operating temperature range.
  • The critical timing parameters for the SM73302MF/NOPB include clock frequency, clock-to-output delay, and output-to-output skew. To ensure timing closure, it is essential to carefully plan and analyze the clock tree, use proper signal routing and termination, and consider the effects of process, voltage, and temperature (PVT) variations.
  • To handle power sequencing and power-down modes for the SM73302MF/NOPB, it is recommended to follow the power-up and power-down sequencing guidelines provided in the datasheet. Additionally, ensure that the power supply voltage is stable and within the recommended operating range during power-up and power-down transitions.
  • To prevent electrostatic discharge (ESD) damage, it is recommended to handle the SM73302MF/NOPB in an ESD-protected environment, use ESD-protective packaging and handling materials, and follow proper grounding and wrist strap procedures during device handling and assembly.

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SM73302MF/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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