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SM73307MM/NOPB - Texas Instruments

Description: Dual Precision, 17 MHz, Low Noise, CMOS Input Amplifier

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SM73307MM/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)-1
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SM73307MM/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)-1
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SM73307MM/NOPB Details

  • Manufacturer Part Number:

    SM73307MM/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    5e-7 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    6 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    17000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

SM73307MM/NOPB Frequently Asked Questions (FAQs)

  • For optimal thermal performance, it is recommended to use a 2-layer or 4-layer PCB with a solid ground plane on the bottom layer. This helps to dissipate heat efficiently. Additionally, ensure that the thermal vias are connected to the ground plane to reduce thermal resistance.
  • To ensure EMC compliance, follow proper PCB layout guidelines, use a shielded enclosure, and ensure that the device is properly grounded. Additionally, use EMI filters and shielding on the input and output lines to minimize electromagnetic interference.
  • The recommended input capacitor value is 10uF to 22uF, with a voltage rating of 25V or higher. A low-ESR ceramic capacitor, such as an X5R or X7R type, is recommended for optimal performance.
  • To troubleshoot output voltage regulation issues, check the input voltage, output load, and feedback resistors. Ensure that the input voltage is within the recommended range, the output load is within the specified current limit, and the feedback resistors are correctly configured.
  • The recommended operating temperature range for the SM73307MM/NOPB is -40°C to 125°C. However, the device can operate up to 150°C with derating. Ensure that the device is properly heat-sinked and follow proper thermal design guidelines to maintain optimal performance.

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SM73307MM/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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