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SM73307MMX/NOPB - Texas Instruments

Description: Dual Precision, 17 MHz, Low Noise, CMOS Input Amplifier

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SM73307MMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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SM73307MMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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SM73307MMX/NOPB Details

  • Manufacturer Part Number:

    SM73307MMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0001 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    85 dB

  • Common-mode Reject Ratio-Nom:

    100 dB

  • Frequency Compensation:

    YES

  • Input Offset Current-Max (IIO):

    5e-7 µA

  • Input Offset Voltage-Max:

    150 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    6 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Screening Level:

    AEC-Q100

  • Seated Height-Max:

    1.07 mm

  • Slew Rate-Nom:

    9.5 V/us

  • Supply Current-Max:

    3.4 mA

  • Supply Voltage Limit-Max:

    6 V

  • Supply Voltage-Nom (Vsup):

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    17000

  • Voltage Gain-Min:

    10000

  • Wideband:

    NO

  • Width:

    3 mm

SM73307MMX/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing trace lengths, and avoiding vias under the device. Additionally, ensure that the input and output capacitors are placed close to the device and that the power and ground pins are connected to a low-impedance path.
  • The selection of input and output capacitors depends on the specific application and operating conditions. As a general guideline, use low-ESR capacitors with a value between 10uF to 22uF for the input capacitor and 10uF to 47uF for the output capacitor. Ensure that the capacitors are rated for the maximum operating voltage and have a low equivalent series resistance (ESR) to minimize losses.
  • The SM73307MMX/NOPB has an operating temperature range of -40°C to 125°C. However, it's essential to consider the derating of the device's performance and reliability at higher temperatures. Always check the thermal design and ensure that the device is operated within the recommended temperature range to ensure optimal performance and reliability.
  • To ensure proper power-up and power-down sequencing, follow the recommended power-up and power-down procedures outlined in the datasheet. Ensure that the input voltage is stable and within the recommended range before enabling the device. During power-down, ensure that the input voltage is reduced to zero before disabling the device.
  • Common pitfalls to avoid when designing with the SM73307MMX/NOPB include: not following the recommended PCB layout, not using adequate input and output capacitors, not ensuring proper power-up and power-down sequencing, and not considering the device's thermal design and operating temperature range.

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SM73307MMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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