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SM8S12ATHE3/I - Vishay

Description: TVS DIODE 12V 19.9V DO218AC

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PCB Footprints
SM8S12ATHE3/I - Vishay PCB footprint - Other - Other - SM8S12ATHE3/I-1
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SM8S12ATHE3/I - Vishay  - 3D model - Other - SM8S12ATHE3/I-1
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SM8S12ATHE3/I Details

  • Manufacturer Part Number:

    SM8S12ATHE3/I

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    HIGH RELIABILITY

  • Breakdown Voltage-Max:

    14.7 V

  • Breakdown Voltage-Min:

    13.3 V

  • Breakdown Voltage-Nom:

    14 V

  • Case Connection:

    ANODE

  • Clamping Voltage-Max:

    19.9 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-218AC

  • JESD-30 Code:

    R-PSSO-C1

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    6600 W

  • Number of Elements:

    1

  • Number of Terminals:

    1

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    245

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    8 W

  • Reference Standard:

    AEC-Q101

  • Rep Pk Reverse Voltage-Max:

    12 V

  • Reverse Current-Max:

    150 µA

  • Reverse Test Voltage:

    12 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

SM8S12ATHE3/I Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SM8S12ATHE3/I is a rectangular pad with a size of 2.5 mm x 1.5 mm, with a solder mask clearance of 0.2 mm. It's essential to follow the recommended land pattern to ensure proper soldering and to prevent thermal issues.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB by using a thermal pad or a thermal interface material. Also, consider using a heat sink or a thermal management system to dissipate heat efficiently. The maximum operating temperature of the device is 150°C, so it's crucial to keep the junction temperature below this threshold.
  • The maximum surge current rating for the SM8S12ATHE3/I is 100 A for a duration of 10 ms. It's essential to ensure that the device is not subjected to surge currents exceeding this rating to prevent damage or failure.
  • While the SM8S12ATHE3/I is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 1 MHz. However, it's crucial to consider the device's parasitic capacitance and inductance, which may affect its performance at high frequencies. Additional filtering or impedance matching may be necessary to ensure proper operation.
  • To ensure the reliability of the SM8S12ATHE3/I in a humid environment, consider applying a conformal coating to the device and the PCB. This will help protect the device from moisture and corrosion. Additionally, ensure that the device is stored in a dry environment, and follow proper handling and soldering procedures to prevent damage.

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SM8S12ATHE3/I Overview

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