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SM91501ALE - Bourns

Description: Audio Transformers / Signal Transformers BMS xformer 2-Ch 1600V AECQ +125 C

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PCB Footprints
SM91501ALE - Bourns PCB footprint - Small Outline Packages - Small Outline Packages - 12-PIN SMD/SMT
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3D Models
SM91501ALE - Bourns  - 3D model - Small Outline Packages - 12-PIN SMD/SMT
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SM91501ALE Details

  • Manufacturer Part Number:

    SM91501ALE

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Unknown

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    8

  • Application:

    BATTERY MANAGEMENT SYSTEM

  • Approvals:

    AEC-Q200

  • Height:

    5 mm

  • Input Voltage-Nom:

    1600 V

  • Isolation Voltage:

    4300 V

  • Length:

    14.81 mm

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Packing Method:

    TR, 13 INCH

  • Primary Inductance:

    150 µH

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Nickel/Copper (Sn/Ni/Cu)

  • Transformer Type:

    PULSE TRANSFORMER

  • Turns Ratio (Np:Ns):

    1CT:1CT

  • Width:

    11.68 mm

SM91501ALE Frequently Asked Questions (FAQs)

  • Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management, minimize parasitic inductance, and optimize the overall performance of the SM91501AL-E.
  • The selection of input and output capacitors depends on the specific requirements of your application, such as voltage rating, capacitance value, and ESR. Bourns recommends using low-ESR capacitors with a voltage rating of at least 2x the maximum input voltage. A good starting point is to use capacitors with a capacitance value of 10uF to 22uF for the input and 22uF to 47uF for the output.
  • The SM91501AL-E has an operating temperature range of -40°C to +125°C, but the maximum junction temperature (TJ) should not exceed 150°C. It's essential to ensure proper thermal management and heat sinking to prevent overheating and ensure reliable operation.
  • To ensure EMC and reduce EMI, follow proper PCB layout and design practices, such as using a solid ground plane, minimizing loop areas, and using shielding and filtering components as needed. Additionally, consider using a metal shield or enclosure to contain EMI radiation. Bourns also provides guidance on EMC and EMI reduction in their application notes and design guides.
  • Bourns recommends a soldering profile with a peak temperature of 260°C to 270°C, a dwell time of 10-30 seconds, and a ramp rate of 3°C/second to 6°C/second. It's essential to follow a controlled soldering process to prevent damage to the device and ensure reliable operation.

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SM91501ALE Overview

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