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SMA3109-TL-E - onsemi

Description: High Gain : GP = 23 dB typ @1.0 GHz; Low current : ICC = 16 mA typ; High output power : PO(1 dB) = 4.0 dBm; Port impedance : input/output 50 Ω

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SMA3109-TL-E - onsemi - PCB symbol
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PCB Footprints
SMA3109-TL-E - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SC−88FL / MCPH6 CASE 419AS ISSUE A
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3D Models
SMA3109-TL-E - onsemi - 3D model - SO Transistor Flat Lead - SC−88FL / MCPH6 CASE 419AS ISSUE A
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SMA3109-TL-E Details

  • Manufacturer Part Number:

    SMA3109-TL-E

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC 88FL / MCPH6

  • Pin Count:

    6

  • Manufacturer Package Code:

    419AS

  • Country Of Origin:

    Mainland China

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    6

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Equivalence Code:

    FL6,.06,25

  • Power Supplies:

    3 V

  • RF/Microwave Device Type:

    WIDE BAND LOW POWER

  • Supply Current-Max:

    20.5 mA

  • Surface Mount:

    YES

  • Terminal Finish:

    Silver (Ag)

SMA3109-TL-E Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. A minimum of 2oz copper thickness is recommended. Additionally, vias should be placed under the thermal pad to connect to the copper area.
  • Ensure that the device is operated within the recommended temperature range (-40°C to 150°C). Use a heat sink or thermal interface material to improve heat dissipation. Also, consider derating the device's power handling at high temperatures.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for input decoupling. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.
  • Use a shielded enclosure, keep the device away from antennas and other EMI sources, and use a common-mode choke or ferrite bead on the input lines. Additionally, ensure that the PCB layout is designed to minimize loop areas and radiation.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for output filtering. The capacitor should be placed as close to the device as possible to minimize parasitic inductance.

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SMA3109-TL-E Overview

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