The recommended footprint and land pattern for SMAJ11A can be found in the Littelfuse application note AN9313, which provides guidelines for surface mount assembly of TVS diodes.
To ensure reliability in high-temperature applications, it is recommended to derate the power rating of SMAJ11A according to the temperature derating curve provided in the datasheet. Additionally, ensure that the device is properly soldered and that the PCB is designed to minimize thermal stress.
Yes, SMAJ11A can be used in a parallel configuration to increase the power rating. However, it is essential to ensure that the devices are properly matched and that the PCB is designed to minimize current imbalance between the devices.
The ESD rating of SMAJ11A is not explicitly stated in the datasheet. However, Littelfuse recommends that the device can withstand a minimum of 15kV human body model (HBM) and 1kV charged device model (CDM) ESD events.
Yes, SMAJ11A is compatible with lead-free soldering processes. The device is constructed with a lead-free alloy and is suitable for use in RoHS-compliant applications.
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