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SMAJ200A-TP - MCC

Description: • For Surface Mount Applications • Excellent Clamping Capability • High Temp Soldering:260°C / 10 Seconds At Terminals • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) • ESD protection of data lines in accordance with IEC 61000-4-2, ±30kV(Air),±30kV (Contact)

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PCB Footprints
SMAJ200A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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3D Models
SMAJ200A-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ200A-TP Details

  • Manufacturer Part Number:

    SMAJ200A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    247 V

  • Breakdown Voltage-Min:

    224 V

  • Breakdown Voltage-Nom:

    235.5 V

  • Clamping Voltage-Max:

    324 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMAJ200A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint for SMAJ200A-TP is a standard SMA (DO-214AC) footprint with a pad size of 2.5mm x 1.5mm and a spacing of 0.5mm between pads.
  • Yes, SMAJ200A-TP is compatible with lead-free soldering and is RoHS compliant.
  • The maximum operating temperature range for SMAJ200A-TP is -55°C to 150°C.
  • Yes, SMAJ200A-TP is suitable for high-reliability applications, including aerospace, defense, and medical devices, due to its high surge capability and low leakage current.
  • To prevent ESD damage, handle SMAJ200A-TP with ESD-safe materials, wear an ESD strap, and store the devices in ESD-safe packaging.

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SMAJ200A-TP Overview

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