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SMAJ54A-TP - MCC

Description: • For Surface Mount Applications • Excellent Clamping Capability • High Temp Soldering:260°C / 10 Seconds At Terminals • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) • ESD protection of data lines in accordance with IEC 61000-4-2, ±30kV(Air),±30kV (Contact)

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SMAJ54A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ54A-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ54A-TP Details

  • Manufacturer Part Number:

    SMAJ54A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    66.3 V

  • Breakdown Voltage-Min:

    60 V

  • Breakdown Voltage-Nom:

    63.15 V

  • Clamping Voltage-Max:

    87.1 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    54 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMAJ54A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMAJ54A-TP can be found in the IPC-7351 standard or in the manufacturer's application notes. A typical footprint consists of a rectangular pad with a size of 2.5mm x 1.25mm and a solder mask clearance of 0.1mm.
  • The thermal derating of SMAJ54A-TP can be handled by reducing the maximum power dissipation as the ambient temperature increases. A typical derating curve can be found in the datasheet, which shows the maximum power dissipation at different temperatures. For example, at 50°C, the maximum power dissipation may be reduced to 50% of the maximum value at 25°C.
  • The ESD rating of SMAJ54A-TP is typically 30kV for human body model (HBM) and 1kV for charged device model (CDM). However, it's recommended to check the datasheet or contact the manufacturer for the latest information.
  • Yes, SMAJ54A-TP can be used in high-reliability applications, but it's recommended to follow the manufacturer's guidelines for screening and qualification. Additionally, the device should be operated within the recommended operating conditions and derating should be applied as necessary.
  • To select the correct SMAJ54A-TP, consider the following factors: voltage rating, current rating, power dissipation, and package type. Ensure that the device meets the requirements of your application, and consult the datasheet and manufacturer's application notes for guidance.

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SMAJ54A-TP Overview

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