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SMAJ58A-TP - MCC

Description: • For Surface Mount Applications • Excellent Clamping Capability • High Temp Soldering:260°C / 10 Seconds At Terminals • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant (Note2) ("P" Suffix Designates RoHS Compliant. See Ordering Information) • ESD protection of data lines in accordance with IEC 61000-4-2, ±30kV(Air),±30kV (Contact)

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SMAJ58A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ58A-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ58A-TP Details

  • Manufacturer Part Number:

    SMAJ58A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    71.2 V

  • Breakdown Voltage-Min:

    64.4 V

  • Breakdown Voltage-Nom:

    67.8 V

  • Clamping Voltage-Max:

    93.6 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    58 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

SMAJ58A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint and land pattern for SMAJ58A-TP can be found in the Micro Commercial Components' application note or in the IPC-7351 standard. It's essential to follow the recommended footprint to ensure reliable soldering and to prevent thermal and mechanical stress.
  • To ensure reliability in high-temperature applications, it's crucial to follow the recommended derating curve, ensure good thermal management, and avoid exceeding the maximum junction temperature (Tj) of 150°C. Additionally, consider using a thermally conductive material for the PCB and ensure good airflow around the component.
  • The SMAJ58A-TP has a human body model (HBM) ESD rating of 2 kV. To protect it from ESD damage, handle the components in an ESD-safe environment, use ESD-protective packaging, and consider adding ESD protection devices in the circuit design.
  • Yes, the SMAJ58A-TP can be used in high-frequency circuits. However, consider the parasitic inductance and capacitance of the component, and ensure that the PCB layout is optimized for high-frequency operation. Additionally, consider the self-resonant frequency of the component and ensure it does not interfere with the operating frequency of the circuit.
  • Select the correct SMAJ58A-TP variant by considering the required standoff voltage, peak pulse current, and power dissipation. Refer to the datasheet and application notes to ensure the selected variant meets the application requirements.

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SMAJ58A-TP Overview

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