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SMAJ8.5A-TP - MCC

Description: 14.4V Clamp 27.7A Ipp Tvs Diode Surface Mount DO-214AC (SMA)

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SMAJ8.5A-TP - MCC PCB footprint - Diodes Moulded - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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3D Models
SMAJ8.5A-TP - MCC  - 3D model - Diodes Moulded - SMA (DO-214AC) LEAD FRAME
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SMAJ8.5A-TP Details

  • Manufacturer Part Number:

    SMAJ8.5A-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • Breakdown Voltage-Max:

    10.4 V

  • Breakdown Voltage-Min:

    9.44 V

  • Breakdown Voltage-Nom:

    9.92 V

  • Clamping Voltage-Max:

    14.4 V

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    TRANS VOLTAGE SUPPRESSOR DIODE

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Peak Rev Power Dis-Max:

    400 W

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    8.5 V

  • Surface Mount:

    YES

  • Technology:

    AVALANCHE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SMAJ8.5A-TP Frequently Asked Questions (FAQs)

  • The recommended footprint for SMAJ8.5A-TP is a rectangular pad with dimensions of 2.5mm x 1.5mm, with a 0.5mm radius corner and a 0.3mm solder mask clearance.
  • Yes, SMAJ8.5A-TP is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • Yes, SMAJ8.5A-TP is compatible with lead-free soldering processes, such as SAC305 or Sn96.5Ag3Cu0.5. However, the soldering profile may need to be adjusted to ensure reliable joints.
  • The typical response time of SMAJ8.5A-TP to an ESD event is less than 1 nanosecond. This fast response time helps to protect sensitive electronics from ESD damage.

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SMAJ8.5A-TP Overview

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